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In the silver plating of copper, K[Ag(CN)₂] is used instead of AgNO₃. The reason is
Options
(a) a thin layer of Ag is formed on Cu
(b) more voltage is required
(c) Ag⁺ ions are completely removed from solution
(d) less availability of Ag⁺ ions,as Cu can not displace Ag from [Ag(CN)₂]⁻ ion
Correct Answer:
less availability of Ag⁺ ions,as Cu can not displace Ag from [Ag(CN)₂]⁻ ion
Explanation:
No explanation available. Be the first to write the explanation for this question by commenting below.
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Topics: Coordination Compounds
(87)
Subject: Chemistry
(2512)
Important MCQs Based on Medical Entrance Examinations To Improve Your NEET Score
- Radius ratio of an ionic compound is 0.93. The structure of the above
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Subject: Chemistry (2512)
Important MCQs Based on Medical Entrance Examinations To Improve Your NEET Score
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