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In the silver plating of copper, K[Ag(CN)₂] is used instead of AgNO₃. The reason is
Options
(a) a thin layer of Ag is formed on Cu
(b) more voltage is required
(c) Ag⁺ ions are completely removed from solution
(d) less availability of Ag⁺ ions,as Cu can not displace Ag from [Ag(CN)₂]⁻ ion
Correct Answer:
less availability of Ag⁺ ions,as Cu can not displace Ag from [Ag(CN)₂]⁻ ion
Explanation:
No explanation available. Be the first to write the explanation for this question by commenting below.
Related Questions: - Which of the following is the most electronegative element?
- At 25⁰C, the dissociation constant of a base, BOH, is 1.0 ˣ 10⁻¹².
- Which one of the following liquid pairs will exhibit a positive deviation from
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Topics: Coordination Compounds
(87)
Subject: Chemistry
(2512)
Important MCQs Based on Medical Entrance Examinations To Improve Your NEET Score
- Which of the following is the most electronegative element?
- At 25⁰C, the dissociation constant of a base, BOH, is 1.0 ˣ 10⁻¹².
- Which one of the following liquid pairs will exhibit a positive deviation from
- Which of the following doesn’t give a ppt. with silver nitrate solution
- Schottky defect defines imperfection in the lattice structure of a
Topics: Coordination Compounds (87)
Subject: Chemistry (2512)
Important MCQs Based on Medical Entrance Examinations To Improve Your NEET Score
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